Study on grain removal characteristics and influencing factors of polycrystalline tungsten during polishing process

Ma, Jian; Wan, Hongbing; Peng, Feng; Chen, Hongyu; Chen, Chang; Chen, Pengqi; Beri, Tufa Habtamu; Chen, Heng; Ren, Kun; Lyu, Binghai

doi:10.1016/j.precisioneng.2024.10.004

Precision Engineering

2024

DOI: 10.1016/j.precisioneng.2024.10.004

|View full text |Cite

Study on grain removal characteristics and influencing factors of polycrystalline tungsten during polishing process

Jian Ma,

Hongbing Wan,

Feng Peng

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

2025

Publication Types

Select...

Article3

Relationship

Self Cite0

Independent3

Authors

Journals

Cited by 3 publications

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Dominant parameters and mechanisms influencing the electrochemical shear-thickening polishing of 4H-SiC

Shen,

Wei,

et al. 2024

Ceramics International

View full text Add to dashboard Cite

Dominant parameters and mechanisms influencing the electrochemical shear-thickening polishing of 4H-SiC

Shen,

Wei,

et al. 2024

Ceramics International

View full text Add to dashboard Cite

Study of ReaxFF molecular dynamics simulation about chemical reactions mechanisms of magnesium-aluminium spinel polishing

Zhao,

Ruan,

Chen

et al. 2025

Computational Materials Science

View full text Add to dashboard Cite

Investigate on surface/subsurface damage mechanisms and manufacturability of ultra-smooth surface in ultra-precision ductile grinding of sapphire optics

Wang,

Zhang,

Zhao

et al. 2025

Journal of Materials Research and Technology

View full text Add to dashboard Cite

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Study on grain removal characteristics and influencing factors of polycrystalline tungsten during polishing process

Cited by 3 publications

References 35 publications

Dominant parameters and mechanisms influencing the electrochemical shear-thickening polishing of 4H-SiC

Dominant parameters and mechanisms influencing the electrochemical shear-thickening polishing of 4H-SiC

Study of ReaxFF molecular dynamics simulation about chemical reactions mechanisms of magnesium-aluminium spinel polishing

Investigate on surface/subsurface damage mechanisms and manufacturability of ultra-smooth surface in ultra-precision ductile grinding of sapphire optics

Contact Info

Product

Resources

About