Study on Preparation and Photolithography of Negative-work Photosensitive Polyester Acrylate

Abstract

This study aims to investigate fabrication and photolithography of negative-work photosensitive transparent insulation material for one glass solution (OGS) applying in touch panel. In this work, two reactive monomers, namely, dipentaerythritol hexaacrylate (DPHA) and tri (propylene glycol) diacrylate (TPGDA), were respectively blended with the mixture of 50% 1-hydroxy-cyclohexylphenyl-ketone and 50% benzophenone, and polyester acrylic oligomer in propylene glycol monomethyl ether acetate (PGMEA); and the photolithography of resulted negative-work photosensitive transparent insulation materials with different solid content was determined by characteristic curve and the optical microscope (OM). As shown in the results, it was found that the photolithographic resolution, which is termed by the ratio of line width to line space, is significantly affected by the solid content of as-prepared negative-work photosensitive polymer. Based on 8 µm line width and space at 1 µm film thickness, the photolithographic resolution of photosensitive polyester acrylate containing 19.7 wt% solid content could reach 1.1 after irradiating by 600 mJ/cm 2 ultraviolet visible light and developing by 0.01 wt% KOH solution for 60 seconds in this explore.