Study on the compounding of a new type of trimer epoxy resin curing agent

Abstract

In this paper, bisphenol A (BPA), epichlorohydrin (ECH), and isocyanate trimer (TDI‐T) are used as raw materials to synthesize a high toughness/trimer epoxy resin by graft copolymerization. It was cured at room temperature with low molecular weight polyamide 650 (PA650)/isophorone diamine (IPDA) and low molecular weight polyamide 650/triethylene tetramine (TETA) composite curing system respectively. The cured products of the two compound systems were studied by Fourier transform infrared spectroscopy (FT‐IR), differential scanning calorimetry (DSC), thermogravimetry (TG), and mechanical property testing. The results show that with the increase of TETA and IPDA curing agents, the heat released during the curing process of the two systems also greatly increases, and the temperature rises from the initial 33.9–69.7°C and 52.8°C. The curing time is shortened from a few days to a few hours, and the controllability of the curing time is effectively realized. When the ratio of triethylene tetramine to low molecular weight polyamide 650 is 2.86:100, the compressive strength is the best, reaching 112.7 MPa, 12% higher than pure polyamide as curing agent, and the specimen can be completely restored to its original shape in a few minutes. When the ratio of TETA to PA650 is 2.86:100, the elongation at break reaches 21.4%.

Study on a novel epoxy‐terminated dendritic modifier as an active toughening agent for epoxy resin

“…With the temperature rising, the unsaturated chain segment carbamate group on the main chain of the curing system started to be oxidized and decomposed. 49 This process disrupted the cross-linking structure of the EP TGDEP (20) and hastened decomposition. However, there is no significant TG difference between EP TGDEP (20) and EP Neat, implying no impact on its practical applications.…”