2017 40th International Spring Seminar on Electronics Technology (ISSE) 2017
DOI: 10.1109/isse.2017.8000907
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Study on the interdependence of soldering profile, ageing conditions and intermetallic layer thickness in large area solder joints and its influence on reliability

Allen Jose George
1
,
Juergen Zipprich
2
,
Markus Klingler
3
et al.
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