Sub-micron-structure machining on silicon by femtosecond laser

Tsai, Hsiang‐Lin; Luo, Shao-Wei; Wu, Chih-Wei; Wang, Shing-Hoa

doi:10.1016/s1003-6326(10)60266-x

Cited by 5 publications

(15 citation statements)

References 16 publications

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“…The schematic diagram is shown in Fig. 7.39 [27]. Photoresist of SU8 is coated onto (110) substrates in thickness of 100 mm.…”

Section: Experiments Setupmentioning

confidence: 99%

“…The laser writing route is shown in Fig. 7.40 [27]. The machined surface is observed by scanning electron microscopy (SEM).…”

Section: Experiments Setupmentioning

confidence: 99%

“…The machined surface is observed by scanning electron microscopy (SEM). Figure 7.41a [27] shows the SEM image of SU8 machined by using the laser power of 60 mW and the scanning speed of 3 mm/min. It shows no obvious ablation in the central part of machined area except the edges where the laser beam moves slowly.…”

Section: Experiments Setupmentioning

confidence: 99%

“…It shows no obvious ablation in the central part of machined area except the edges where the laser beam moves slowly. Figure 7.41b [27] shows the SEM image of the silicon substrate under SU8, which is removed after femtosecond laser machining. Since the NA number of the object lens is not large enough, the focal spot size is not small enough.…”

Section: Experiments Setupmentioning

confidence: 99%

“…7.42 [27]. The SU8 photoresist on the silicon substrate could be ablated as a rectangle structure when the laser power was increased to over 200 mW.…”

Section: Su8mentioning

confidence: 99%

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Micromachining by Photonic Beams

Tsai

Hocheng

Wang

et al. 2012

Advanced Analysis of Nontraditional Machining

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We analyze a laser dragging process capable of ablating a groove pattern, and producing sophisticated 3D features, on a polycarbonate (PC) sheet through a shaped mask opening. To predict the machined profile during the dragging process, we developed a mathematical model that describes the relationship between laser machining parameters and the produced profile. In addition, we manufacture a miniature lamp lens by varying the mask shape, and dimensions based on the proposed model. The effects of the micro-size lamp lens on light efficiency are investigated. On the other hand, this chapter also introduces a study of sub-micron-structure machining on silicon substrates by a direct writing system using a femtosecond laser with the central wavelength of 800 nm, pulse duration of 120 fs and repetition rate of 1 kHz. Three types of experiment are studied: (1) The effect of photoresist on silicon, (2) The machinability of different orientations of silicon: spike morphologies were observed on all three orientations of silicon substrates without obvious directional difference of these spikes on the different silicon substrates, (3) Micro-structure size and cross-section shape: a numerical model of the machining parameters has been proposed to simulate the cross-section of the micro-structure resulting from a given ablation energy. The predicted shape, determined by simulation, fitted the profile of the cross-section shape well.

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“…The schematic diagram is shown in Fig. 7.39 [27]. Photoresist of SU8 is coated onto (110) substrates in thickness of 100 mm.…”

Section: Experiments Setupmentioning

confidence: 99%

“…The laser writing route is shown in Fig. 7.40 [27]. The machined surface is observed by scanning electron microscopy (SEM).…”

Section: Experiments Setupmentioning

confidence: 99%

Section: Experiments Setupmentioning

confidence: 99%

Section: Experiments Setupmentioning

confidence: 99%

“…7.42 [27]. The SU8 photoresist on the silicon substrate could be ablated as a rectangle structure when the laser power was increased to over 200 mW.…”

Section: Su8mentioning

confidence: 99%

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