Super-compatible functional boron nitride nanosheets/polymer films with excellent mechanical properties and ultra-high thermal conductivity for thermal management

Wang, Jiemin; Wu, Yuanpeng; Xue, Ye; Liú, Dan; Wang, Xuebin; Hu, Xiao; Bando, Yoshio; Lei, Weiwei

doi:10.1039/c7tc04860b

Cited by 142 publications

(90 citation statements)

References 34 publications

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“…In 1998, Kawakami and Kato first used small bis‐pyridine molecules as the external cross‐linker for liquid‐crystalline polymers, leading to increased mesophase stability. Up to now, a variety of H‐bond cross‐linkers, such as small organic molecules, nanoparticles, and polymer aggregates, have been developed to cross‐link polymeric materials. These external cross‐linkers can play a similar role to UPy motifs in improving the mechanical and thermal properties of the polymers via physical cross‐linking by using multiple H‐bonding interactions.…”

Section: Design Of H‐bond Cross‐linked Polymer Materialsmentioning

confidence: 99%

“…Because of abundant oxygen‐containing groups on the surface, nanomaterials, such as nanodiamond (ND), graphene oxide dots (GOD), and boron nitride (BN) nanosheets, enable the formation of multiple H‐bonding interactions with PVA. For instance, our group recently synthesized GOD as an artificial β‐sheet to cross‐link PVA because GOD are structurally and chemically analogous to the β‐sheets in spider silk.…”

Section: Design Of H‐bond Cross‐linked Polymer Materialsmentioning

confidence: 99%

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High‐Performance Polymeric Materials through Hydrogen‐Bond Cross‐Linking

2019

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to traditional metallic and ceramic materials. [1] Therefore, it has been desirable to create high-performance polymeric materials that are mechanically robust, thermostable, and even healable for meeting practical applications in industry. The creation of cross-linked polymers has been regarded as one promising approach for creating strong and thermally stable polymers. [3][4][5] Cross-linked polymers normally exhibit superior mechanical and thermostable performances to their uncrosslinked counterparts. [6][7][8][9][10] Traditionally, a chemically covalent approach has been the primary means for realizing the cross-linking of polymeric materials. As compared with the parent polymer, cross-linked polymers normally gain enhanced mechanical strength and thermal stability. [6][7][8][9][10][11] This strategy, however, gives rise to significantly reduced extensibility because of the exclusive molecular mechanism between strength, extensibility, and toughness. [12][13][14][15] By contrast, noncovalent cross-linking can lead to increased mechanical strength without sacrificing the extensibility and toughness of polymeric materials. Such cross-linking can be realized by adopting strong noncovalent interactions including Coulombic interactions, [11] dipoledipole interactions, [12] metal coordination, [13] and hydrogenbonding (H-bonding) interactions. [5,16] To date, H-bonding is among the most extensively employed noncovalent interactions for the creation of cross-linked polymeric materials with tunable microstructure and tailor-made performances because of its directionality, versatility, and reversibility. In 1997, Meijer and co-workers [17] pioneered the synthesis of the first reversible cross-linked polymer by reacting a trifunctional copolymer of hydroxyl-terminated poly(propylene oxide) with diisocyanate and then 2-ureido-4-pyrimidone (UPy) units capable of forming quadruple H-bonds. The final poly mer shows a relatively high plateau modulus because such H-bond cross-links can serve as entanglements in a linear polymer. Following the synthesis of some uncross-linked polymeric materials containing UPy motifs, [17][18][19] Meijer's group has further synthesized many cross-linked polymeric materials based on UPy motifs. [20][21][22] On the other hand, in many natural biological materials, such as silk [23][24][25][26] and muscle, [27] multiple H-bonding interactions have recently been revealed to play a critical part in realizing a unique combination of high strength, great It has always been critical to develop high-performance polymeric materials with exceptional mechanical strength and toughness, thermal stability, and even healable properties for meeting performance requirements in industry. Conventional chemical cross-linking leads to enhanced mechanical strength and thermostability at the expense of extensibility due to mutually exclusive mechanisms. Such major challenges have recently been addressed by using noncovalent cross-linking of reversible multiple hydrogen-bonds (H-bonds) that widely exist in biological...

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Section: Design Of H‐bond Cross‐linked Polymer Materialsmentioning

confidence: 99%

Section: Design Of H‐bond Cross‐linked Polymer Materialsmentioning

confidence: 99%

High‐Performance Polymeric Materials through Hydrogen‐Bond Cross‐Linking

2019

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“…The surface modification of filler can be an alternative strategy for improving filler dispersion in the matrix, which has been observed in carbon nanotube and graphene composites . Therefore, how to balance thermal conductivity and other properties, to develop a kind of composite with high TC and excellent mechanical properties at a low filler loading for thermal management applications has become a research focus .…”

Section: Introductionmentioning

confidence: 99%

In situ Polymerization of Polyamide 6/Boron Nitride Composites to Enhance Thermal Conductivity and Mechanical Properties via Boron Nitride Covalently Grafted Polyamide 6

Fang

et al. 2020

Polymer Engineering & Sci

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Polyamide 6/boron nitride (PA6/BN) composites were synthesized via anionic ring‐opening polymerization using ε‐caprolactam as the monomer and functional boron nitride (f‐BN) as the thermal conductive filler. Besides the homopolymerized PA6, some PA6 molecule chains would grow from the f‐BN sheets through the “grafting from” strategy. Compared with unfunctional hexagonal BN (h‐BN), the introduction of f‐BN not only improved the dispersion of f‐BN in the matrix but also enhanced the interface bonding between f‐BN and PA6. The homogeneous dispersion of f‐BN in the PA6/f‐BN composite favored the formation of the continuous thermal conductive paths or network at a low f‐BN loading, and the good interface bonding reduced the phonon scattering in the interface, which improved the thermal conductivity (TC) of the PA6/f‐BN composite by 66.0% compared with that of the pure PA6, when only 5 wt% f‐BN was added. In contrast, with the same content of unfunctional h‐BN loading, the TC of the corresponding composite merely improved by 29.7%. Moreover, Young's modulus and yield strength of PA6/f‐BN composites had increased obviously with the introduction of f‐BN, whereas those of PA6/h‐BN composites showed small fluctuation with the same contents of BN. POLYM. ENG. SCI., 60:710–716, 2020. © 2020 Society of Plastics Engineers

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“…In this case, to obtain the high thermal conductivity of composites, the increase of filler content will lead to a decrease in the mechanical and processing performance of materials [13]. In order to solve the above problem, one method is to enhance the interaction between the filler and the polymer through modification of fillers [14,15]. However, the high thermal interface resistance between randomly distributed fillers limits the further improvement of thermal conductivity of composites.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Gao

Shen

Wang

2020

Mater. Res. Express

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A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO 2 ). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO 2 , the EP/SiO 2 @BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO 2 @BN reached to 0.86 Wm −1 K −1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO 2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO 2 . In addition, the EP/SiO 2 @BN exhibited lower thermal interface resistance in comparison with EP/SiO 2 &BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO 2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.

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Super-compatible functional boron nitride nanosheets/polymer films with excellent mechanical properties and ultra-high thermal conductivity for thermal management

Abstract: Super compatible functional boron nitride (FBN) nanosheets and polyvinyl alcohol (PVA) composite films are well fabricated by facile aqueous vacuum filtering.

Cited by 142 publications

References 34 publications

High‐Performance Polymeric Materials through Hydrogen‐Bond Cross‐Linking

High‐Performance Polymeric Materials through Hydrogen‐Bond Cross‐Linking

In situ Polymerization of Polyamide 6/Boron Nitride Composites to Enhance Thermal Conductivity and Mechanical Properties via Boron Nitride Covalently Grafted Polyamide 6

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

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