Supercritical fluid‐assisted electroless metal plating onto aramid films: The influence of thermal treatment

Abstract

Although the production of electro-conductive aramid fibers is efficient, the method needs to be modified before it can be applied to aramid films. Whereas impregnation of an aramid film with a metal complex using supercritical CO 2 is achievable, the relatively low adhesion strength of the metal layer applied using electroless copper plating is problematic. To solve this problem, thermal treatment was conducted before, after, or both before and after electroless plating. The rationale for using thermal treatment to improve the adhesiveness of the plated layer was based on the findings that (1) an aramid film contains a significant amount of water (about 3.5 % w.o.f.), which might have a negative impact on adhesion; and (2) because an impregnated metal complex liberates metal catalyst by thermal decomposition during impregnation, a supplementary thermal action might liberate more catalyst and thereby improve adhesion. We found that thermal treatment improved adhesion of the metal layer to the aramid film. Moreover, we discovered that with respect to electroless copper plating, a short time-lag was crucial to obtaining a thin and homogeneous metal layer with strong adhesion. In addition, we demonstrate the affinity of an aramid film for Pd(acac) 2 .

Impregnation of Materials in Supercritical CO2 to Impart Various Functionalities

“…Polycarbonate has been impregnated with silver nitrate in scCO 2 , resulting up to 99.9% bacteria reduction [53]. Belmas and co-workers [54][55][56] have used scCO 2 process to impregnate a range of organometallic complexes in a synthetic polymer prior to electroless copper plating to improve the adhesion of copper to the polymer. The adhesion between the copper and polymer was much improved after scCO 2 impregnation of the organometallic complexes.…”

Electroless Deposition of Nanolayered Metallic Coatings

“…Wear and mechanical behavior of reinforced carbon nanofibers improved by electroless Cu alloybased composites [58]. A new method proposed for plating a Cu layer onto an aramid film with a strong bonding by adhesion [59]. Deposition of electroless copper nanofilms on silicon and on polycrystalline germanium substrates seemed to cover an extensive area of the base material compared to other noble metals such as Au, Pt, Pd, and Ag [60].…”

Supercritical CO2 deposition and foaming process for fabrication of biopolyester–ZnO bone scaffolds

“…SCFD was mainly considered for production of nanostructured materials for catalysis, electronics and optics. 38,47 A great potential of the SCFD for fabrication of medical devices has been recognized through the recent reports on scCO 2 -aided deposition of metal species with antibacterial activity, namely silver ions onto silicone, 48 ultra-high molecular-weight-polyethylene films, 49 and cotton. 50 Fluorinated metal chelates are well known for excellent solubility in scCO 2 .…”