Surface-modified Li3Mg2NbO6 ceramic particles and hexagonal boron nitride sheets filled PTFE composites with high through-plane thermal conductivity and extremely low dielectric loss

Wang, Hao; Ye, Hui; Wang, Qinlong; Tong, Jianxi; Wen, Jingyang; Zhang, Qilong

doi:10.1016/j.coco.2020.100523

Cited by 24 publications

(15 citation statements)

References 32 publications

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“…In addition, with the further increase of filler, the void in the film would not reduce, but gradually increase, leading to the increase of dielectric loss. When working at high frequencies, the polarization of dipole and space charge was very weak or non-existent, and the defects in the composites became an important factor affecting the dielectric loss [ 76 ]. However, when the filler content was 40 wt.%, its tanδ was still less than that of pure ANF film, which was due to the Coulomb block and quantum confinement effect of AgNP [ 77 , 78 ].…”

Section: Resultsmentioning

confidence: 99%

Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

et al. 2021

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The development of highly thermally conductive composites with excellent electrical insulation has attracted extensive attention, which is of great significance to solve the increasingly severe heat concentration issue of electronic equipment. Herein, we report a new strategy to prepare boron nitride nanosheets (BNNSs) via an ion-assisted liquid-phase exfoliation method. Then, silver nanoparticle (AgNP) modified BNNS (BNNS@Ag) was obtained by in situ reduction properties. The exfoliation yield of BNNS was approximately 50% via the ion-assisted liquid-phase exfoliation method. Subsequently, aramid nanofiber (ANF)/BNNS@Ag composites were prepared by vacuum filtration. Owing to the “brick-and-mortar” structure formed inside the composite and the adhesion of AgNP, the interfacial thermal resistance was effectively reduced. Therefore, the in-plane thermal conductivity of ANF/BNNS@Ag composites was as high as 11.51 W m−1 K−1, which was 233.27% higher than that of pure ANF (3.45 W m−1 K−1). The addition of BNNS@Ag maintained tensile properties (tensile strength of 129.14 MPa). Moreover, the ANF/BNNS@Ag films also had good dielectric properties and the dielectric constant was below 2.5 (103 Hz). Hence, the ANF/BNNS@Ag composite shows excellent thermal management performance, and the electrical insulation and mechanical properties of the matrix are retained, indicating its potential application prospects in high pressure and high temperature application environments.

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Section: Resultsmentioning

confidence: 99%

Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

et al. 2021

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“…A powder-resin mixture was prepared. The rheological properties of the powder-resin mixture are a crucial parameter for the 3D-printing process [31,[37][38][39]. Higher mixing rations enable a better loading content.…”

Section: Printing Processmentioning

confidence: 99%

Additive Manufactured Waveguide for E-Band Using Ceramic Materials

et al. 2021

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Ceramic materials are chemical- and temperature-resistant and, therefore, enable novel application fields ranging from automotive to aerospace. With this in mind, this contribution focuses on developing an additive manufacturing approach for 3D-printed waveguides made of ceramic materials. In particular, a special design approach for ceramic waveguides, which introduces non-radiating slots into the waveguides sidewalls, and a customized metallization process, are presented. The developed process allows for using conventional stereolithographic desktop-grade 3D-printers. The proposed approach has, therefore, benefits such as low-cost fabrication, moderate handling effort and independence of the concrete waveguide geometry. The performance of a manufactured ceramic WR12 waveguide is compared to a commercial waveguide and a conventionally printed counterpart. For that reason, relevant properties, such as surface roughness and waveguide geometry, are characterized. Parsing the electrical measurements, the ceramic waveguide specimen features an attenuation coefficient of 30–60 dB/m within the E-Band. The measured attenuation coefficient is 200% and 300% higher compared to the epoxy resin and the commercial waveguide and is attributed to the increased surface roughness of the ceramic substrate.

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“…The ε r of COC/20 vol% Sr 2 CeO 4 @SiO 2 at 10 GHz is 3.5, while the ε r of pure COC is 2.2. The polarization mechanisms in composites include electronic polarization, ion polarization and orientation polarization, and different polarization mechanisms have different frequency responses [8,35]. The dielectric constant of composites is affected by multiple polarization mechanisms.…”

Section: Dielectric Propertiesmentioning

confidence: 99%

“…With the introduction of more fillers, the CTE of the composites decreases, reaching a minimum of 37.7 ppm/ • C at a filler content of 20 vol%. The lower coefficient of thermal expansion of the composites can reduce the thermal stress with the copper foil and improve the thermal stability of the copper-clad laminate [8]. Figure 11a shows the flexural strength of the untreated and modified composites.…”

Section: Coefficient Of Thermal Expansion and Mechanical Propertiesmentioning

confidence: 99%

“…Among the low-ε r and low-τ ε high-frequency substrates, the resin materials with good application prospects mainly include polytetrafluoroethylene (PTFE) [7,8], modified polypheylene ether (MPPE) [9,10], modified polyimide (MPI) [11], liquid crystal polymer (LCP) [12,13], etc. As an important engineering plastic, cyclic olefin copolymer (COC) is mainly used in optics, packaging materials, biomedicine, electronic components, and other fields [14,15].…”

Section: Introductionmentioning

confidence: 99%

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Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Wang

Zhang³

et al. 2021

Polymers

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High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

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Surface-modified Li3Mg2NbO6 ceramic particles and hexagonal boron nitride sheets filled PTFE composites with high through-plane thermal conductivity and extremely low dielectric loss

Cited by 24 publications

References 32 publications

Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

Ultra-Robust Thermoconductive Films Made from Aramid Nanofiber and Boron Nitride Nanosheet for Thermal Management Application

Additive Manufactured Waveguide for E-Band Using Ceramic Materials

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

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