Surface-mount manufacturing for e-textile circuits

Molla, Md. Tahmidul Islam; Goodman, Steven; Schleif, Nicholas; Berglund, Mary Ellen; Zacharias, Cade; Compton, Crystal; Dunne, Lucy E.

doi:10.1145/3123021.3123058

Cited by 39 publications

(32 citation statements)

References 12 publications

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“…Unfortunately, there has not been much research conducted to solve the connector problem for the electronic-textile industry. It is shown that utilisation of non-conductive epoxy-glue encapsulation on top of the conductive and brittle connectors improves the durability and the lifetime of the device [15,16].…”

Section: Construction Of Secsmentioning

confidence: 99%

Review on Smart Electro-Clothing Systems (SeCSs)

Sayem

Teay

Shahariar

et al. 2020

Sensors

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This review paper presents an overview of the smart electro-clothing systems (SeCSs) targeted at health monitoring, sports benefits, fitness tracking, and social activities. Technical features of the available SeCSs, covering both textile and electronic components, are thoroughly discussed and their applications in the industry and research purposes are highlighted. In addition, it also presents the developments in the associated areas of wearable sensor systems and textile-based dry sensors. As became evident during the literature research, such a review on SeCSs covering all relevant issues has not been presented before. This paper will be particularly helpful for new generation researchers who are and will be investigating the design, development, function, and comforts of the sensor integrated clothing materials.

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Section: Construction Of Secsmentioning

confidence: 99%

Review on Smart Electro-Clothing Systems (SeCSs)

Sayem

Teay

Shahariar

et al. 2020

Sensors

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“…In 2015, Berglund and Duvall [66], and Molla et. al, [67], introduced a novel technique for assembling surface-mount fabric PCBs using stitched traces and reflow soldering techniques. The results showed that all configurations were sufficiently durable for low-intensity wear, while for high intensity wear larger components and traces are needed to improve the durability.…”

Section: Mechanical Connectorsmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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“…Molla et al [21] integrated LEDs into textile structures by soldering conductive uninsulated yarns. The LEDs could be soldered to the exposed conductors, but in particular, the solder wicking along the multi-filament affects the durability of the joint and added stiffness to the textile.…”

Section: Solderingmentioning

confidence: 99%

Soldering Electronics to Smart Textiles by Pulsed Nd:YAG Laser

2020

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Experts attest the smart textiles market will have high growth potential during the next ten years. Laser soldering is considered to be a good contacting method because it is a contactless process. For this reason, it is intended to investigate the contacting process of printed circuit boards (PCB) to isolated conductive textile strips by means of a ytterbium-doped fiber laser (1064 nm). During the investigation, the copper strands in the textile tape were stripped by the laser and soldered to the PCB without any transport of the textile. Therefore, we investigated different sets of parameters by means of a design of experiment (DoE) for different types of solder pastes. Finally, the joinings were electrically analyzed using a contact resistance test, optically with a REM examination, and mechanically using a peeling test.

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Surface-mount manufacturing for e-textile circuits

Cited by 39 publications

References 12 publications

Review on Smart Electro-Clothing Systems (SeCSs)

Review on Smart Electro-Clothing Systems (SeCSs)

Review on the Integration of Microelectronics for E-textile

Soldering Electronics to Smart Textiles by Pulsed Nd:YAG Laser

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