Synthesis and Characterisation of Silica/Polyamide-Imide Composite Film for Enamel Wire

A Short Review on Polymer Nanocomposites for Enameled Wires: Possibilities and Perspectives

“…Relevant work on silica/polyamide-imide composite films for enameled wires revealed that the way the silica nanoparticles are treated plays a dominant role in determining the behavior of the nanocomposite. Spherical silica nanoparticles modified with the cationic surfactant cetyltrimethyl ammonium bromide (CTAB) were successfully dispersed into the PAI matrix and improved the thermal stability and decomposition temperature of the pure PAI polymer [41]. The partial discharge behavior was also improved since the authors of [41] considered that charged particles are reflected and scattered around the silica nanoparticles, improving thus the partial discharge resistance.…”

“…Spherical silica nanoparticles modified with the cationic surfactant cetyltrimethyl ammonium bromide (CTAB) were successfully dispersed into the PAI matrix and improved the thermal stability and decomposition temperature of the pure PAI polymer [41]. The partial discharge behavior was also improved since the authors of [41] considered that charged particles are reflected and scattered around the silica nanoparticles, improving thus the partial discharge resistance. Their interpretation as to why partial discharges seem to be less in nanocomposites than in conventional polymers conforms with the interpretations given in [19,23].…”

“…The authors of [41] suggested that the optimum percentage of nanoparticles into the PAI matrix is 3 wt%. However, in yet another study by the same authors, no agglomerations of silica nanoparticles were observed up to 10 wt% [42].…”