Synthesis and thermal, optical and morphological characterization of oligomeric polyamides based on thiophene and alkyl/phenyl‐silane moieties. Study of the electrospun deposition process

Abstract

Polyamides were synthesized from a thiophene-containing diamine by direct polycondensation with organosilane acyl dichlorides. The obtained polymers had good solubility in common organic solvents and THF, with TDT 10% values upper than 400 8C and T g between 150 and 180 8C. Combination of these properties reveals that the processability of the polymers was increased with respect to traditional aromatic polyamides. Inherent viscosity values and SEC analysis indicated low molecular weight species. Samples showed high visible transparency and bandgap values associated to insulating materials. Polymer solutions were deposited using electrospun technique and their surface properties were studied by SEM. Spheres were created according to electric field applied during deposition process. Low molecular weight and conductivity prevent charge accumulation in the surface hindering fibers generation.

Oligomeric poly(ether‐imide)s bearing ortho trifluoromethyl groups: Solubility, thermal studies, and optical properties

“…In both cases, a signal near to 8 ppm was observed, which agree with the magnetic environment of the heteroatom. This fact has been previously reported by our group in several articles …”

Polyamidation of new diamine monomers containing bulky pendant groups based on imidazole ring and fabrication of polyamide/modified‐SiO2composite: Properties and applications

“…15,16 The high structural hardness of these polymers arises from forming the strong inter-molecular hydrogen bonds that in turn cause their insolubility in many common organic solvents and increase melting point and crystallinity nature, which finally leads to their processing difficulties and limited practical usages. 17 To overcome PAs' main trouble and better process them, PAs chemical structures are modified without compromising their mechanical and thermal properties. Introducing the bulky pendant units, 13,18,19 flexible linkages, 20 electron-donating moieties, 21 and heterocyclic segments 22 into the polymer chains are some of the approaches used to modify PAs structure.…”