A B S T R A C TA simple process is presented that realizes carbon nanotube (CNT) arrays that meet the process and structure requirements for use in large-scale integrated circuits. Ni particles are formed densely on a conductive TiN layer on SiO 2 /Si substrates through nucleation and growth by sputtering, which was stopped prior to percolation of the Ni particles. Ni particles as dense as 2.8 · 10 12 cm À2 were formed after annealing at 400°C and chemical vapor deposition (CVD) was carried out at 400°C by feeding C 2 H 2 at partial pressures as low as 0.13-1.3 Pa so as not to kill the catalyst. Scanning electron microscopy with energy dispersive X-ray spectroscopy revealed the mass density of the arrays to be as high as 1.1 g cm À3 . High resolution transmission electron microscopy showed the densely packed CNTs with an average wall number of eight. Atomic force microscopy of the root of the CNT arrays transferred to a SiO 2 /Si substrate enabled direct counting of individual CNTs, revealing areal densities of CNTs and CNT walls as high as 1.5 · 10 12 and 1.2 · 10 13 cm À2 , respectively. The simple process, using conventional sputtering and CVD apparatus, with carefully engineered conditions offers a route for practical application of CNTs.