2008 58th Electronic Components and Technology Conference 2008
DOI: 10.1109/ectc.2008.4550265
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System-in-package for extreme environments

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Cited by 12 publications
(2 citation statements)
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“…The SiP was sealed to prevent contaminants and moisture from entering and causing corrosion. Filling the SiP with nitrogen also protected the bare core to some extent (Sivaswamy et al , 2008). The chips were tiled onto the substrate side-by-side.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The SiP was sealed to prevent contaminants and moisture from entering and causing corrosion. Filling the SiP with nitrogen also protected the bare core to some extent (Sivaswamy et al , 2008). The chips were tiled onto the substrate side-by-side.…”
Section: Methodsmentioning
confidence: 99%
“…The low thermal resistance of the system allows the internal electronic components to dissipate heat rapidly. With this technology, the temperature level of existing chips can be increased (Liu et al , 2011; Sivaswamy et al , 2008; Sham et al , 2006; Yu et al , 2012). In an SiP system, an entire circuit system is packaged in one device with a low thermal resistance to allow the circuit to continue operating at high temperatures.…”
Section: Introductionmentioning
confidence: 99%