Systematic root cause analysis of metal defects in FINFET devices

Lua, Winson; Lim, Soon-Huat; Ravikumar, Venkat Krishnan; Phoa, Angelina

doi:10.1109/ipfa.2017.8060119

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2017

DOI: 10.1109/ipfa.2017.8060119

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Systematic root cause analysis of metal defects in FINFET devices

Winson Lua¹,

Soon-Huat Lim²,

Venkat Krishnan Ravikumar³

et al.

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Systematic root cause analysis of metal defects in FINFET devices

Cited by 1 publication

References 7 publications

Metal Migration Induced Breakdown from Gate Contact in Bulk FinFET Devices

Metal Migration Induced Breakdown from Gate Contact in Bulk FinFET Devices

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