This paper presents a novel approach for fabricating lead-based layered perovskite films. The perovskite structure was formed during the transfer of a perovskite-unform monolayer onto a substrate. The transferred film had a flat and smooth surface, and the surface roughness was greatly improved from 5.5 nm to 1.8 nm, compared to the transferred film of a perovskite-form monolayer on the water.