Techniques for nano-scale deformation measurement

Abstract

Deformation measurement of mechanical-electrical devices is important for their reliability evaluation. However, with the development of fabrication technology, sizes of mechanical-electrical devices are reduced to micro or even nano-scale. Correspondingly, testing resolution of the required metrology techniques must be improved to the same or even higher level. The commonly used characterization facility with nano-scale resolution is STWAFWSEM etc. In this paper, some metrology technologies based on these facilities for nano-scale deformation measurement, e.g. AFWSEM moire and AFMiSEM digital speckle correlation are introduced, including their principles, advantages and disadvantages. Their applications in the deformationistrain measurement of MEMS and IC packages will be highlighted.