Abstract:Combination of three-dimensional (3D) IC technology and network on chip (NoC) is an effective solution to increase system scalability and also alleviate the interconnect problem in large-scale integrated circuits. However, because of the increased power density in 3D NoC systems and the destructive effect of high temperatures on chip reliability, applying thermal management solutions becomes crucial in such circuits. In this study, the authors propose a runtime distributed migration algorithm based on game the… Show more
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