Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Šandera, Josef; Nicak, Michal

doi:10.1108/ssmt-02-2013-0004

Cited by 2 publications

(1 citation statement)

References 12 publications

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“…The thermo-mechanical properties are usually investigated by analysing crack lengths, crack propagation and regions of fracture due to various thermal stresses, e.g. temperature cycling (Chen et al, 2015), (Šandera and Nicák, 2014), (Arfaei et al, 2013) or thermal shock tests (Zhang et al, 2011;Suhling et al, 2004;Jankowski et al, 2014).…”

Section: Introductionmentioning

confidence: 99%

Method for validating CT length measurement of cracks inside solder joints

Garami

Krammer

Harsányi

et al. 2016

Soldering &Amp; Surface Mount Technology

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Purpose – This paper aims to develop a method to measure the length of cracks inside solder joints, which enables the validation of computed tomography (CT) crack length measurements. Design/methodology/approach – Cracks were formed inside solder joints intentionally by aging solder joints of 0603 size resistors with thermal shock (TS) test (−40 to +140°C, 2,000 cycles), and CT images were captured about them with different rotational increment (1/4, 1/2 and 1°) of sample projection. The length of cracks was also measured with our method, which is based on capturing high-resolution radiography X-ray images about the cracks in two perpendicular projection planes. The radiography results were compared to the CT measurements. The percentage error for the different CT rotational increment settings was calculated, and the optimal CT settings have been determined. Findings – The results have proven that reducing the rotational increment increases the sharpness of the captured images and the accuracy of crack length measurements. Nevertheless, the accuracy compared to high-resolution radiography measurements is only slightly better at 1/4° rotational increment than in the case of 1/2° rotational increment. It should be also noted that the 1/4° increment requires twice as much time for capturing the images as the 1/2° increment. So, the 1/2° rotational increment of sample projection is the optimal setting in our investigated case for measuring crack lengths. Practical implications – The developed method is applicable to find the optimal settings for CT crack length measurements, which provides faster analysation of large quantity samples used, e.g. at life-time tests. Originality/value – There is a lack of information in the literature regarding the optimisation of CT measurement set-up, e.g. a slightly larger value of the sample rotational increment can provide acceptable resolution with much faster processing time. Thus, the authors developed a method and performed research about optimising CT measurement parameters.

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Section: Introductionmentioning

confidence: 99%

Method for validating CT length measurement of cracks inside solder joints

Garami

Krammer

Harsányi

et al. 2016

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

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Bonding of zero-shrink LTCC with alumina ceramics

Somer

Štekovič

Urban

et al. 2015

Soldering &Amp; Surface Mount Technology

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Purpose – The purpose of this paper is to focus on a description of reliable bonding technique of zero-shrink low-temperature co-fired ceramic (LTCC) and alumina ceramics. LTCC is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates, it is now possible to bond unfired substrates with other fired substrates, for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. Design/methodology/approach – The test structure contains a thick-film pattern for verification of the compatibility of the bonding process. We have used two methods for bonding the substrates: cold chemical lamination (CCL) and thermo compression method, using a dielectric thick-film paste as the adhesive. Optical microscopy, scanning electron microscopy and electric testing of the screen-printed patterns were used for verification of the bonding quality. Findings – The thermo-compression method gave poor results in comparison with the CCL method. The best quality of lamination was achieved at room temperature combined with low pressure for both types of bonding materials. In addition, a possibility of using this bonding method for sensor fabrication was investigated. The ceramic pressure sensor samples with a cavity were created. Originality/value – The possibility of bonding two different ceramic materials was investigated. A new approach to ceramic bonding showed promising results with possible use in sensors.

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Temperature cycling with Peltier elements of boards with SMD components and failure evaluation

Cited by 2 publications

References 12 publications

Method for validating CT length measurement of cracks inside solder joints

Method for validating CT length measurement of cracks inside solder joints

Bonding of zero-shrink LTCC with alumina ceramics

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