Temperature Prediction on Substrates and integrated Circuit Chips

Pinto, Elmano; Mikić, B. B.

doi:10.1080/01457638808939671

Cited by 10 publications

(5 citation statements)

References 4 publications

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“…The solution of the temperature field in the entire domain has to be obtained through following the conservation law; the heat flux across the interface of any two neighboring subzones must be balance. For instance, at interface SAB of zone A and zone B, allow the global energy balance equation to be written as (12) The heat flux across the segment from zone A to zone B can be written in discretized form. Then Eq.…”

Section: S~r)mentioning

confidence: 99%

“…The geometric complexities of the problem limits the extensive use of analytical solutions. Unlike analytical approaches, the finite-element, the finite-difference, and other numerical approaches have the ability to solve these problems with complex geometries and boundary conditions [5][6][7][8][9][10][11][12][13][14]. But when they treat plane sources, it is necessary to discretize the neighboring portions of these sources more finely so that the steep gradients of solutions are calculated accurately.…”

Section: Introductionmentioning

confidence: 99%

“…There exist analytical and numerical solutions for the heat conduction problems of finite domain with plane heat sources [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. The analytical solution permits a drastic reduction in program, and the solution algorithm can be easily implemented on a minicomputer [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Analysis/Finite-Element Combined Methodology on Temperature Distribution of a Finite Domain With Various Heat Sources

Wu¹,

Shii²

1994

Numerical Heat Transfer, Part B: Fundamentals

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A new method, involving the combined use of analysis and the finite-element method, is applicable to the heal conduction problem with isoltlled heat sources. Unlike the finite-element method, the analysis/ finite-element combined metlwd is able to discretiie the distributed sources with discontinuities into course elements, and the solution is stiU calcuJated accurately. The resuJJs are compared in tables with exaa solutions and other numerical data, and the agreement is found to be good.

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Section: S~r)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Analysis/Finite-Element Combined Methodology on Temperature Distribution of a Finite Domain With Various Heat Sources

Wu¹,

Shii²

1994

Numerical Heat Transfer, Part B: Fundamentals

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“…Pinto and Mikic (1986) employ the analytical method. Funk et al, (1992) use a semianalytical method to prodict the steady-state temperature of printed circuit boards (PCBs).…”

Section: Introductionmentioning

confidence: 99%

Model reduction techniques for speeding up the thermal simulation of printed circuit boards

Chang

Shui

2000

Journal of the Chinese Institute of Engineers

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This paper initiates a measuring method to reduce the traditional three-dimensional thermal circuit models into the two-dimensional compact ones. The new thermal models are represented by the equivalent circuits which can be simulated in the SPICE. Furthermore, the ambient temperature and the power of the components are also decoupled to equivalent voltage and current sources, respectively. Therefore, when the ambient temperature or the power of the component changes, the compact thermal models can still work without doing any regeneration work. The proposed technique can greatly reduce the simulation time of heat transfer of printed circuit boards. Furthermore, the reduced models can be connected to any place on the model of the printed circuit board. The proposed technique provides a systematic synthetic way to build up models of printed circuit boards.

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“…Solution of two-dimensional heat conduction in such domains, has numerous applications in engineering-for example, electronic devices and heat exchangers. Related solution procedures may be analytical [1; 2] or numerical [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Analysis/finite-difference combined solution of boundary value problems of heat conduction in finite domains with planar-discrete sources

Chiou

Chou³

2001

Commun. Numer. Meth. Engng.

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An analysis=ÿnite-di erence combined solution is presented for two-dimensional heat conduction problems in a ÿnite domain with planar-discrete sources. In this method, each region of plane source is covered by a primary zone in which the analytic method is applied, while the remaining domain is identiÿed as a secondary zone in which the ÿnite di erence is applied. This approach can easily deal with the large local gradients and discontinuities across the source interfaces without ÿne mesh.

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Temperature Prediction on Substrates and integrated Circuit Chips

Cited by 10 publications

References 4 publications

Analysis/Finite-Element Combined Methodology on Temperature Distribution of a Finite Domain With Various Heat Sources

Analysis/Finite-Element Combined Methodology on Temperature Distribution of a Finite Domain With Various Heat Sources

Model reduction techniques for speeding up the thermal simulation of printed circuit boards

Analysis/finite-difference combined solution of boundary value problems of heat conduction in finite domains with planar-discrete sources

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