Temperature rise in a birefringent substrate caused by RF discharge plasma

Takaki, Koichi; Sayama, Kunio; Takahashi, Atsushi; Fujiwara, Tamiya; Nagata, M.; Ono, M.; Jani, Muaffaq Achmad

doi:10.1002/(sici)1520-6416(199906)127:4<9::aid-eej2>3.3.co;2-x

Elect. Eng. Jpn.

1999

DOI: 10.1002/(sici)1520-6416(199906)127:4<9::aid-eej2>3.3.co;2-x

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Temperature rise in a birefringent substrate caused by RF discharge plasma

Koichi Takaki

Kunio Sayama

Atsushi Takahashi

et al.

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2014

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Numerical Analysis of Material Temperature Distribution

Jani¹

2014

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The temperature of the surface of a material in a manufacturing process of plasma is very important information, while the results of measurements usually indicate the average temperature of the material. By using the method of numerical analysis, the distribution of temperature on the thickness of the material can be formulated using the heat conduction equation for material. Heat distribution that occurs is computed using a heat flux parameter input power, the heat transfer coefficient and surface area of the material. Simulations performed on the heat distribution PMMA and LiNbO3 crystal with thickness of 2 to 2.5 mm.

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Numerical Analysis of Material Temperature Distribution

Jani¹

2014

AMR

Self Cite

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show abstract

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Temperature rise in a birefringent substrate caused by RF discharge plasma

Cited by 1 publication

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Numerical Analysis of Material Temperature Distribution

Numerical Analysis of Material Temperature Distribution

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