IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370)
DOI: 10.1109/epep.1998.733861
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Temperature stable thermoplastic microwave materials and copper laminates

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“…The patents11–18 available basically describe the process of preparing hybrid fabric and composites and attention regarding resin‐fiber properties and their importance is not well documented.…”
Section: Introductionmentioning
confidence: 99%
“…The patents11–18 available basically describe the process of preparing hybrid fabric and composites and attention regarding resin‐fiber properties and their importance is not well documented.…”
Section: Introductionmentioning
confidence: 99%