Testing Station for Fast Screening of Through Silicon Via (TSV)-enabled Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors
Abstract:Application Specific Integrated Circuits (ASICs) are used in space-borne instruments for signal processing and detector readout. The electrical interface of these ASICs to frontend printed circuit boards (PCBs) is commonly accomplished with wire bonds. Through Silicon Via (TSV) technology has been proposed as an alternative interconnect technique that will reduce assembly complexity of ASIC packaging by replacing wire bonding with flip-chip bonding. TSV technology is advantageous in large detector arrays where… Show more
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