Textile-Integrated Electronics For Small Airplanes

Cupal, Miroslav; Dfínovský, J.; Götthans, Tomáš; Hermány, Roman; Kokolia, Martin; Láčík, Jaroslav; Pafízek, T.; Prášek, Jan; Raida, Zbyněk; Špirrek, J.; Kracalova, Dita; Ledrova, Zdenka; Procházka, Jiří; Krutilek, David; Reznícek, D.

doi:10.1049/cp.2018.0845

Cited by 11 publications

(7 citation statements)

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“…In Reference , the three‐dimensional (3D) knitted fabric SINTEX T2‐3D 041 was used instead of a microwave substrate to integrate a waveguide and an antenna array into a textile layer between a glas‐laminate panel and a skin of a small airplane. The fabrics can provide thermal insulation and attenuation of vibrations.…”

Section: Introductionmentioning

confidence: 99%

“…When creating a textile‐based planar circuit or an antenna, the corresponding part of a surface is covered by a thin film to smooth the surface and eliminate penetrations into the fabric. Metallic surfaces are manufactured by screen printing of a silver paste, and conductive vias can be implemented by conductive threads …”

Section: Introductionmentioning

confidence: 99%

“…Antennas and transmission lines described in Reference follow the concept of substrate‐integrated structures. In that case, PIN diodes can be used to switch vias from a low‐impedance state to a high‐impedance one, and vice versa.…”

Section: Introductionmentioning

confidence: 99%

“…Metallic surfaces are manufactured by screen printing of a silver paste, and conductive vias can be implemented by conductive threads. 1 In order to control textile-integrated electronics, proper textile-integrated switches have to be implemented. In most applications, planar circuits or antennas have been manufactured from an electrically conductive textile material or a self-adhesive copper foil, and PIN diodes have played the role of radio-frequency switches overbridging gaps in planar layouts.…”

Section: Introductionmentioning

confidence: 99%

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Textile‐integrated waveguide switch for ISM band 5.8 GHz

Cupal

Raida

2020

Micro & Optical Tech Letters

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In this article, a textile‐integrated waveguide (TIW) switch designed for the ISM band 5.8 GHz is presented. Conductive surfaces of the switch are manufactured by screen printing using a silver paste, and side walls of the TIW are sewed by a conductive thread. The switch is based on a common TIW T‐divider which is completed by controllable conductive posts in both branches. The controllable posts can be switched from the high‐impedance state to the low impedance state (and vice versa) by connecting or disconnecting them to the conductive layers by PIN diodes. Transmissions of the open branch of the switch and the closed one are |S21| = −1.5 dB and |S31| = −14.9 dB, respectively. If the manufactured switch is completed by transitions from TIW to coaxial line, the transitions of the open branch and the closed one are|S21| = −6.2 dB and |S31| = −15.6 dB, respectively.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Textile‐integrated waveguide switch for ISM band 5.8 GHz

Cupal

Raida

2020

Micro & Optical Tech Letters

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“…Thus, the SmartJacket is marketed by companies such as Google, Levi’s (with an emphasis on cell phone connection and entertainment), Kinesix (the World’s First Customizable Smart Heating Jacket), and, generally, manufacturers of biking, firefighting, and medical equipment [9]. Major drawbacks consist in sensitivity of the jacket to adverse weather conditions and limited washability, although new materials and integrated fabric antennas are being designed to improve the durability and capabilities of the product [10,11,12].…”

Section: Introductionmentioning

confidence: 99%

New Approaches to Implementing the SmartJacket into Industry 4.0 ‡

Marcoň

Arm

Benešl

et al. 2019

Sensors

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The paper discusses the possibilities of incorporating sensors and indicators into the environment of an Industry 4.0 digital factory. The concept of Industry 4.0 (I4.0) is characterized via a brief description of the RAMI 4.0 and I4.0 component model. In this context, the article outlines the structure of an I4.0 production component, interpreting such an item as a body integrating the asset and its electronic form, namely, the Asset Administration Shell (AAS). The formation of the AAS sub-models from the perspectives of identification, communication, configuration, safety, and condition monitoring is also described to complete the main analysis. Importantly, the authors utilize concrete use cases to demonstrate the roles of the given I4.0 component model and relevant SW technologies in creating the AAS. In this context, the use cases embody applications where an operator wearing a SmartJacket equipped with sensors and indicators ensures systematic data collection by passing through the manufacturing process. The set of collected information then enables the operator and the system server to monitor and intervene in the production cycle. The advantages and disadvantages of the individual scenarios are summarized to support relevant analysis of the entire problem.

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