The 773 K isothermal section of the phase diagram of ternary Ni–Ti–Y system

Zhuang, Yinghong; Luo, Ying; He, Wei

doi:10.1016/s0925-8388(99)00573-3

Cited by 5 publications

(2 citation statements)

References 7 publications

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“…In this study, we opted for the established Cu90PSn brazing filler metal. Drawing upon the Cu-P and Cu-Sn phase diagrams depicted in Figure 1 and corroborated by relevant literature (Zhuang and Sun, 1989;Tang and Tian, 2009;Zhang and Zhuang, 2011;Li et al, 2018), it was discerned that the cast structure of Cu90PSn brazing filler metal predominantly comprises the α-Cu solid solution, the Cu 3 P compound, and a low-melting-point eutectic; noticeably absent was any compound involving tin.…”

Section: Composition Design Of Brazing Filler Metalsupporting

confidence: 79%

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Effect of E-waste copper alloy additions on the microstructure and organization of Cu90PSn brazing joints

Bao,

Yang,

Zhang

et al. 2024

Front. Chem.

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The effects of different contents of e-waste alloy on the microstructure and joint properties of Cu90PSn brazing filler metal was investigated during copper and copper brazing. Microstructure of base metal and brazing filler metal was studied with scanning electronic microscopy (SEM). The properties of brazing joint obtained by adding different electronic waste filler metal for smelting copper alloy were compared together. The results indicated that the fluidity of Cu90PSn brazing filler metal was weakened and the spreading property of Cu90PSn brazing filler metal was damaged after the addition of e-waste copper alloy. The structure of Cu90PSn brazing filler metal is mainly composed of (Cu), Cu3P and (Cu,Sn) compounds. When a small amount of electronic waste copper alloy is added, a trace amount of Fe in the brazing filler metal is distributed in the matrix structure of the filler metal in the form of solid solution. With the increase of copper alloys contents by smelting e-waste, Fe content in Cu90PSn brazing filler metal increases; the granular Fe3P phosphide changes into lamellar form. The Cu3P compound phase changes from continuous large orderly arrangement to discontinuous small block structure. Therefore, adding a trace amount of electronic waste copper alloy to the solder induction brazing copper/copper can obtain a uniform composition of the brazing structure. And the welding performance is not affected. However, As the content of e-waste smelted copper alloy continues to increase, the tensile strength shows a downward trend, which is attributed to the presence of brittle compound Fe3P in the joint.

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Section: Composition Design Of Brazing Filler Metalsupporting

confidence: 79%

“…Given the insights derived from the literature, it is plausible that the infiltrating Fe will foster the genesis of a needle-shaped, hard, and brittle Phase diagram (Tang and Tian, 2009;Zhang and Zhuang, 2011). Fe3P phase within the Cu-P brazing filler metal (Xue et al, 1998).…”

Section: Composition Design Of Brazing Filler Metalmentioning

confidence: 99%