The Concentration-Response Curve Relation Between Air Pollution and Respiratory Hospital Admissions in Children Under 5 Years Old in Taiyuan, Shanxi, China

Zhao, Bao xin; Zhang, Yan Ping; Zhang, Zhi Qin; Wu, Yong; Li, Jing Fen; Liu, Xu Hui

doi:10.1097/01.ede.0000392373.70355.26

Cited by 1 publication

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“…Generally, to improve the impact resistance of missile-borne electronic systems, it is necessary to adopt certain protective measures, strengthening the protection of inertial measurement elements [ 4 ]. One effective way is to fill the remaining space inside the structure with buffer materials when the devices are assembled [ 5 ].…”

Section: Introductionmentioning

confidence: 99%

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Sun

2021

Sensors

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In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed. However, the shrinkage tensile stress in the potting adhesive weakened the anti-overload ability of the circuit board. When there was a small amount of expansion stress in the potting adhesive, the overload resistance of the circuit board could be partially increased. From the analysis, it is indicated that a material with a certain expansion property, elasticity, and dense structure should be selected as the potting adhesive. This article provides a reference for improving the overload resistance of electronic devices.

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Section: Introductionmentioning

confidence: 99%

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Sun

2021

Sensors

View full text Add to dashboard Cite

show abstract

The Concentration-Response Curve Relation Between Air Pollution and Respiratory Hospital Admissions in Children Under 5 Years Old in Taiyuan, Shanxi, China

Cited by 1 publication

References 0 publications

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

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