The development of a high-precision environmentally friendly method for measuring the thickness of rolled sheets

The reliability of soldered joints produced at a low temperature

“…devices are under severe thermal and vibration operating conditions, which are determined by both inter nal and external factors [2,3,11].…”

“…Some developers are inclined to consider that frequent failures occur due to severe thermal and vibration conditions that are caused by various factors, including internal thermal and vibration operating condi tions of instruments [2,3]. However, even if severe thermal and vibration conditions, under which instru ments operate, are eliminated, the causes of frequent system failures do not always disappear.…”

“…Failures most frequently occur in instruments that operate under conditions of elevated temperatures, vibrations, etc., for example, in instruments for controlling leaks from gas and oil pipelines using opticalelectronic systems (OESs) [1], gauges for monitoring the thickness of produced rolled sheets [2], etc. Some developers are inclined to consider that frequent failures occur due to severe thermal and vibration conditions that are caused by various factors, including internal thermal and vibration operating condi tions of instruments [2,3].…”

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

“…For example, during the quality control of parameters of flats, an automated control system operates at elevated temperatures and high vibration levels [4]. There fore, the search for solutions that reduce the number of defects of soldered joints in electronic devices that operate at elevated temperatures and high levels of vibration is of a great significance.…”