2024 IEEE 3rd International Conference on Problems of Informatics, Electronics and Radio Engineering (PIERE) 2024
DOI: 10.1109/piere62470.2024.10805006
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The Method to Inspect Ball- Type Wire Bonding in a Non-Destructive Testing System for Integrated Circuits

Alexandr A. Golitsyn,
Natalia A. Seyfi,
Sergei A. Golitsyn
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