The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–<i>x</i>In lead-free solder alloys

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The microstructure, melting properties and wettability of Sn–3.5Ag–0.7Cu–xIn lead-free solder alloys

Cited by 6 publications

References 37 publications

Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste

Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste

Effects of In addition on the properties of Sn–4Ag–0.5Cu–3Bi–0.05Ni solder

The effect of indium microalloying on lead-free solders: A review

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