The Next Step to Higher Density Multilayer PWBs Using Microvia Technoligies. Plastic Package for Flip Chip Application Using Multi-Layered Build up Printed Wiring Board.

Asai, Motoo

doi:10.5104/jiep1995.13.70

The Journal of Japan Institute for Interconnecting and Packagin

1998

DOI: 10.5104/jiep1995.13.70

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The Next Step to Higher Density Multilayer PWBs Using Microvia Technoligies. Plastic Package for Flip Chip Application Using Multi-Layered Build up Printed Wiring Board.

Motoo Asai

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The Next Step to Higher Density Multilayer PWBs Using Microvia Technoligies. Plastic Package for Flip Chip Application Using Multi-Layered Build up Printed Wiring Board.

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