The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging
Zeyu You,
Ling Weng,
Zijian Wu
et al.
Abstract:As an emerging field of current technological development, the heat dissipation performance of electronic packaging materials has become the key to determining product reliability. Therefore, the applied thermal interface materials (TIMs) need to simultaneously meet the performance indicators of thermal conductivity, mechanics, and insulation. Although BN had excellent in‐plane thermal conductivity and insulation performance, it is currently difficult to achieve vertical orientation of powder which leads the l… Show more
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