The Production and Through‐hole Plating of Modern Base Materials

Abstract

Today modern epoxy base materials for printed circuit board production are designed with properties which ensure high dimensional stability, resistance to chemical action, and increased glass transition temperature, in order to meet the stringent demands now encountered in electronics use. Polyfunctional epoxy resins and the appropriate hardener/accelerator compositions are in widespread, effective use in the design of superior laminates. The quality of the through‐hole plating for holes drilled in these improved materials will depend on various parameters, including those covered by three main complexes: base material, mechanical processing, and chemical processes used for treatment of the drilled hole. Special attention is paid in this paper to the resin recession phenomenon in terms of processing parameters.