The Progress and Trend of Heterogeneous Integration Silicon/III-V Semiconductor Optical Amplifiers

Shi, Wei; Zou, Canwen; Cao, Yulian; Liu, Jianguo

doi:10.3390/photonics10020161

Cited by 9 publications

(3 citation statements)

References 89 publications

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“…The demonstrated proof-of-concept devices still have certain challenges, such as the alignment of the metasurface chip on top of a silicon waveguide chip. A practical solution for a compact device is to use flip-chip bonding and transfer printing techniques, 38 or as the most compact solution, to fabricate the reflective metasurface directly on the horizontal surface of the URM. Further, to implement a device that is more useful from the application point of view, such as PR serving as a Pauli-Z gate for quantum computing, 39 more advanced designs are needed in which different waveguides are used as input and output, e.g., a Michelson interferometer based on a 50:50 splitter.…”

Section: Discussionmentioning

confidence: 99%

On-Chip Polarization Rotators Using Metasurface

Shahwar,

Kapulainen,

Haatainen

et al. 2024

ACS Omega

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Metasurfaces, with their ability to finely manipulate light properties (e.g., polarization), represent a frontier in optical technology. Here, we report innovative gold-based metasurfaces that are adept at changing the light polarization across a broad range of incident angles. Their expansive acceptance angle facilitates seamless integration with silicon waveguides, culminating in the realization of a novel, compact, broadband, and low-loss on-chip polarization rotator. The demonstrated metasurface devices show polarization conversion efficiencies as high as 98.5% at 1550 nm in the free space measurements. Unlike conventional plasmonic metasurfaces, which lack broadband capabilities, our metasurface-based waveplates show extinction ratios of >15 dB for a 120 nm bandwidth. These metasurfaces are positioned on top of up-reflecting mirrors fabricated in a micrometer-scale silicon-on-insulator platform to demonstrate on-chip polarization rotation. The demonstrated polarization rotator shows an extinction ratio of more than 10 dB for a 100 nm bandwidth. This study marks the first successful demonstration of on-chip polarization manipulation utilizing metasurface integration, heralding significant potential impacts for enhancing the functionality and miniaturization of photonic integrated circuits.

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Section: Discussionmentioning

confidence: 99%

On-Chip Polarization Rotators Using Metasurface

Shahwar,

Kapulainen,

Haatainen

et al. 2024

ACS Omega

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“…The main consideration when proposing a DSORN as the major communications platform is regarding the ability of supporting devices in FSO such as an optical amplifier. The capability of an optical amplifier to boost a signal strength right now is available and also reaching an advanced stage of development [173,174]. An optical amplifier that has a high power output is the first requirement to transmit an optical propagation thousands of kilometers away from the geo-stationary orbit of Earth.…”

Section: Space Optical Satellite Communicationsmentioning

confidence: 99%

A Review–Unguided Optical Communications: Developments, Technology Evolution, and Challenges

et al. 2023

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This review paper discusses the complete evolution of free-space optical (FSO) communication, also known as unguided optical communication (UOC) technologies, all the way back to ancient man’s fire to today’s machine-learning-supported UOC systems. The principles, significance, and developments that have happened over the past several decades, as well as installation methodologies, technological limitations, and today’s challenges of UOCs are presented. All the subsets of UOC: FSO communication, underwater optical wireless communication (UOWC), and visible light communication (VLC), with their technology/system developments, potential applications, and limitations are reviewed. The state-of-the-art developments/achievements in (i) FSO channel effects and their mitigation techniques; (ii) radio-over-FSO techniques; (iii) wavelength division multiplexing and sub-carrier multiplexing techniques; (iv) FSO for worldwide interoperability for microwave access applications; (v) space optical satellite communication (SOSC); (vi) UWOC; (vii) photoacoustic communication (PAC); (viii) light-fidelity; (ix) VLC; (x) vehicular VLC (V2LC); and (xi) optical camera communication are reviewed. In addition, the current developments on emerging technologies such as artificial intelligence (to improve the performance of UOC systems), energy harvesting (for the effective utilization of UOC channels), and near-future communication network scenarios (mandatory for secured broadband digital links) are covered. Finally, in brief, to achieve the full potential of UOC systems, challenges that require immediate research attention are summarized.

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“…[15][16][17][18] A review of various hybrid integration technologies can be found in. [19][20][21][22] This paper describes the wafer reconstitution process flow of InGaAs/InP tiles on 200 mm silicon substrates and the impact of this integration on diode device performance. The integration scheme uses a template Si pocket wafer for III-V die placement on a temporary carrier with glue.…”

Section: Introductionmentioning

confidence: 99%

Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Karve,

Li,

Motsnyi

et al. 2024

Jpn. J. Appl. Phys.

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Co-integration of III-V and silicon on the same substrate can enable many applications in photonics, RF, imaging and sensing. Wafer reconstitution (WARE) is an embedded multi-die integration platform that allows for integration of heterogenous materials on 200/300mm Si substrates. This paper describes an integration flow for InP die attached to 200mm Silicon. Electrical measurements on InGaAs diodes fabricated on WARE wafers confirm that the performance is similar to devices on native InP substrates.

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The Progress and Trend of Heterogeneous Integration Silicon/III-V Semiconductor Optical Amplifiers

Cited by 9 publications

References 89 publications

On-Chip Polarization Rotators Using Metasurface

On-Chip Polarization Rotators Using Metasurface

A Review–Unguided Optical Communications: Developments, Technology Evolution, and Challenges

Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

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