The SnAgCu solder joint integrity in WLCSP for green conversion

Lee, J.C.B.; Chung, Chi-Sheng; Liu, Chin-Chiang; Tong, Ho‐Ming

doi:10.1109/isapm.2005.1432059

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

DOI: 10.1109/isapm.2005.1432059

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The SnAgCu solder joint integrity in WLCSP for green conversion

J.C.B. Lee

Chi-Sheng Chung

Chin-Chiang Liu

et al.

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Cited by 5 publications

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Board level validation for green IC packaging with strain-controllable dynamic bending method

Lee¹,

Yu²,

Chang³

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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The SnAgCu solder joint integrity in WLCSP for green conversion

Cited by 5 publications

References 2 publications

Board level validation for green IC packaging with strain-controllable dynamic bending method

Board level validation for green IC packaging with strain-controllable dynamic bending method

Board level validation for green IC packaging with strain-controllable dynamic bending method

Investigation of recrystallization in BGA package to evaluate the low Ag solder with different dopants after board level test

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