The ???Wafer??? Procedure

The effect of the wafer procedure on pressure in the distal radioulnar joint

“…8 According to Feldon's original description of the procedure, no more than 4 mm of distal ulna should be resected. 1 Transverse distal ulnar head resection may change the force distribution in the DRUJ by changing its contact area. In the senior author's (A.A.G.)…”

“…Treatment indications include ulnocarpal impaction and triangular fibrocartilage (TFC) tears. 1,2 The wafer procedure may be performed either arthroscopically or as an open procedure. 1,3 It decompresses the ulnocarpal joint and relieves symptoms related to the impaction.…”

“…1,2 The wafer procedure may be performed either arthroscopically or as an open procedure. 1,3 It decompresses the ulnocarpal joint and relieves symptoms related to the impaction. 4 Unlike other procedures that shorten the ulna, the wafer procedure does not alter the relationship between the sigmoid notch and the head of the ulna.…”

Ulnar impaksiyon sendromu

“…Wafer prosedürü ilk olarak açık cerrahi teknikle yapılmıştır. [15] Bu prosedürün amacı ulnanın karpal kemiklerle sıkışmaya yol açan eklem yüzünü 2-3 mm kalınlıkta ortadan kaldırmak ve böylece yüklenmeyi azaltmaktır. Herhangi bir implant kullanılmadan uygulanan bu işlemde büyük cerrahi kesilere ve kemik iyileşmesini beklemeye gerek kalmamaktadır.…”

Chronic wrist pain: Diagnosis and management

“…This can be achieved either by an extra-articular ulnar shortening osteotomy or by a limited resection of the articular surface of ulnar head at the point of impaction with the carpus (Wafer procedure). 34 The extra-articular shortening of the ulna remains the gold standard but Constantine et al compared the results of the two procedures and noted equally good improvement of impaction symptoms in both groups, although the group having open ulnar shortening osteotomy needed more secondary procedures for hardware removal and nonunion. 35 Ulnar impingement syndrome.…”