Abstract:In board manufacturing the shear test is frequently used to evaluate the quality of the solder joints shortly after the soldering process as well as after thermal cycling. The latter evaluation is in particular applied to leadless ceramic components; a certain load drop is linked to solder degradation in a certain region of the joint which is declared "failed" if the load drop of the shear force reaches a predefined limit. However, there are many uncertainties in this evaluation like component misalignment to … Show more
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