Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics

Mazullah,; Sadiq, Muhammad; Khan, Mohsin; Mateen, Abdul; Shahzad, M.I.; Akhtar, Kareem; Khan, Jawad

doi:10.1016/j.microrel.2021.114180

Microelectronics Reliability

2021

DOI: 10.1016/j.microrel.2021.114180

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Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics

Mazullah Mazullah

Muhammad Sadiq

Mohsin Khan

et al.

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Cited by 1 publication

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Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

Chen,

Ye,

Zhuo

et al. 2023

J Mater Sci: Mater Electron

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Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

Chen,

Ye,

Zhuo

et al. 2023

J Mater Sci: Mater Electron

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Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics

Cited by 1 publication

References 32 publications

Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al

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