Thermal and electrical behavior of polyimide/silica hybrid thin films

Hamciuc, Elena; Hamciuc, Corneliu; Olariu, Marius

doi:10.1002/pen.21562

Cited by 27 publications

(29 citation statements)

References 30 publications

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“…The results are collected in Table 2 and a representative curve is shown in Figure 3. It is worth to mention that Kramers-Kronig relations and reflected spectra of thin films, in the spectral region of 400-4000 cm À1 , recorded by the near normal FT-IR reflection spectroscopy have been known as a method for the determination of dielectric parameters of solids [32,35,36].…”

Section: Optical and Dielectric Parametersmentioning

confidence: 99%

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Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid

Babanzadeh

Mehdipour‐Ataei

Mahjoub

2012

Designed Monomers and Polymers

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New polyimide-silica (PI-SiO 2 ) nanohybrids were prepared by the reaction of bis(5-amino-1-naphthoxy) diphenylsilane (5-APS) with commercially available 4,4'-(Hexafluoroisopropylidene) diphthalic anhydride (6-FDA) in the presence of 3-aminopropyl triethoxysilane as a coupling agent and tetraethylorthosilicate (TEOS) as precursor of inorganic network. Hybrid thin films with 5-50 wt.% silica content were synthesized. The prepared PI-SiO 2 films were characterized by Fourier transform infrared spectroscopy and energy dispersive X-ray spectroscopy. The morphology and crystallinity of these hybrid systems were investigated by transmission electron microscopy and XRD analysis. Thermal properties of the nanohybrids were evaluated by thermogravimetric analysis and dynamic mechanical thermal analysis techniques. The optical constants (n and k) and dielectric parameters (e 0 and e 00 ) were calculated from IR reflection spectra by employing the Kramers-Kronig dispersion relations. Under proper condition, the silica particle size was in the range of 50-70 nm for the prepared hybrids. The results showed that presence of silica severely modified the properties of samples.

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Section: Optical and Dielectric Parametersmentioning

confidence: 99%

“…The polymer films exhibited good thermal stability having the initial decomposition temperature above 450°C, glass transition temperature in the range of 223-228°C, and low dielectric constant in the range of 2.64-3.16 [32].…”

Section: Introductionmentioning

confidence: 99%

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid

Babanzadeh

Mehdipour‐Ataei

Mahjoub

2012

Designed Monomers and Polymers

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“…Typically, three relaxation processes are observed with increasing temperature designated as c, b, and a, respectively, with a corresponding to the glass-rubber relaxation. There are some reports, which refer to the characterization and analysis of the electrical and dynamical properties of polyimide hybrid films [36][37][38][39][40][41][42][43][44]. The properties of these materials are dependent on the interphase between filler and the polymer matrix.…”

Section: Introductionmentioning

confidence: 97%

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Hamciuc¹,

Hamciuc²,

Okrasa

et al. 2012

J Mater Sci

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Zeolite L, with the ratio Si/Al = 4, was prepared by hydrothermal method and used to obtain composite films based on a polyimide matrix having pendant carboxylic groups. The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films was studied. The films were prepared by casting a suspension resulting from direct mixing of a poly(amic acid) (PAA) solution and zeolite L particles onto glass plates, followed by thermal imidization under controlled temperature conditions. The PAA was synthesized by solution polycondensation of a mixture of two diamines, 3,5-diaminobenzoic acid and 2,2-bis[4-(4-aminophenoxy)phenyl]propane (molar ratio 1:3), with 4,4 0 -oxydiphthalic anhydride, using N-methyl-2-pyrrolidone as solvent. To improve the compatibility between organic and inorganic phases, the surface of zeolite particles was modified by treating with 3-aminopropyltriethoxysilane. The surface morphology of the composite films investigated by scanning electron microscopy showed good compatibility between filler and polymer matrix. The films were flexible, tough, and exhibited high-thermal stability, having the initial decomposition temperature above 450°C. Dynamic mechanical analysis and dielectric spectroscopy revealed sub-glass transitions, c and b, and an a relaxation corresponding to the segmental motions above the glass transition temperature. The values of the dielectric constant at 10 kHz and 200°C were in the range of 3.3-4.2.

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“…26 There are some reports, which refer to the characterization and analysis of the electrical and dynamical properties of polyimide hybrid films. [27][28][29][30][31] The properties of these materials are dependent on the interphase between filler and the polymer matrix. Polymer filler interactions could produced change in α, β, and γ transitions of the polymer matrix since the amplitude of the relaxation depends on the chain flexibility of the molecules.…”

Section: Introductionmentioning

confidence: 99%

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

Hamciuc¹,

Hamciuc²,

Okrasa

2011

Macromol. Res.

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Hybrid films containing silica were prepared using a poly(amic acid) incorporating polydimethylsiloxane segments and tetraethoxysilane via a sol-gel technique and thermal cyclodehydration. The surface morphology of the films was examined by atomic force microscopy and scanning electron microscopy. The free surface energy was evaluated based on contact angle measurements. The films were flexible and showed good mechanical properties. They exhibited high thermal stability with an initial decomposition temperature above 420 o C and a glass transition temperature in the range of 216-223 o C. Dielectric spectroscopy revealed primary α 1 relaxation due to the polydimethylsiloxane segments, and three subglass transitions: γ, β 1 and β 2 . At higher temperatures, α 2 -relaxation that corresponds to the upper glass transition and a conductivity process appeared. The influence of the silica content on the hybrid film properties was examined. Dynamic mechanical analysis revealed similar relaxation processes to those observed by dielectric spectroscopy.

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Thermal and electrical behavior of polyimide/silica hybrid thin films

Cited by 27 publications

References 30 publications

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

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Thermal and electrical behavior of polyimide/silica hybrid thin films

Cited by 27 publications

References 30 publications

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO2nanohybrid

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO2nanohybrid

The effect of zeolite L content on dielectric behavior and thermal stability of polyimide thin films

Silica/polyimide-polydimethylsiloxane hybrid films. Thermal and electrical properties

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Product

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Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid

Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO₂nanohybrid