Thermal calculator

Hamed, Ahmed; Elzouka, Mahmoud; Ndao, Sidy

doi:10.1016/j.ijheatmasstransfer.2019.01.028

Cited by 24 publications

(23 citation statements)

References 9 publications

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“…Such devices are expected to find applications especially in thermal logic operations in thermal computing. [ 8,9 ]…”

Section: Fluidic Thermal Control Devicesmentioning

confidence: 99%

“…[ 11,244,247 ] One interesting high‐temperature application (up to 700 K) is thermal computing. [ 9,246 ]…”

Section: Mechanical Thermal Control Devicesmentioning

confidence: 99%

“…In the last 20 years, studies based on this discovery have been conducted to realize various applications. [ 4,5,7 ] Starr's discovery also laid the foundation for phononics [ 8 ] and thermal computing [ 9 ] and, in turn, opened up completely new possibilities for the utilization of thermal energy.…”

Section: Introductionmentioning

confidence: 99%

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Fluidic and Mechanical Thermal Control Devices

Klinar

Swoboda

Rojo

et al. 2020

Adv Elect Materials

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In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.

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“…Such devices are expected to find applications especially in thermal logic operations in thermal computing. [ 8,9 ]…”

Section: Fluidic Thermal Control Devicesmentioning

confidence: 99%

“…[ 11,244,247 ] One interesting high‐temperature application (up to 700 K) is thermal computing. [ 9,246 ]…”

Section: Mechanical Thermal Control Devicesmentioning

confidence: 99%

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Fluidic and Mechanical Thermal Control Devices

Klinar

Swoboda

Rojo

et al. 2020

Adv Elect Materials

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“…Based on the concept of coupling NFTR and thermal actuation of a chevron beam actuator, thermal AND and OR gates are constructed using a combination of two thermal diodes and a fixed-value conduction thermal resistance (i.e., solid beams with tailored thermal conductance) 22 .…”

Section: Design and Methodologymentioning

confidence: 99%

“…Further heating to a certain designed temperature causes the two chevrons to interlock and for the terminal surface to expand at a higher rate β, β α > ( ) , effectively achieving the desired amplification mechanism. For the OR gate, the lower terminals (output) are connected together to the heat sink through a fixed conductive resistance 22 . Consequently, the temperature of the output terminal C is a result of the heat balance between the inward heat flows Q or Q ( ) rad NF r ad FF , , from the lower input terminals (A and B) and the outward heat flow to the heat sink Q ( ) cond .…”

Section: Design and Methodologymentioning

confidence: 99%

NanoThermoMechanical AND and OR Logic Gates

Hamed

Ndao

2020

Sci Rep

Self Cite

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today's electronics cannot perform in harsh environments (e.g., elevated temperatures and ionizing radiation environments) found in many engineering applications. Based on the coupling between near-field thermal radiation and MEMS thermal actuation, we presented the design and modeling of nanothermoMechanical AnD, oR, and not logic gates as an alternative, and showed their ability to be combined into a full thermal adder to perform complex operations. in this work, we introduce the fabrication and characterization of the first ever documented Thermal AND and OR logic gates. The results show thermal logic operations can be achieved successfully through demonstrated and easy-tomanufacture nanothermoMechanical logic gates.Today's electronics have limited performance and reliability in harsh environments (e.g., elevated temperatures and ionizing radiation environments) found in many engineering applications such as space exploration (e.g., Venus) and geothermal energy exploitation deep beneath the earth; consequently, developing alternative computing technologies is necessary. Thermal computing, data processing based on heat instead of electricity, is proposed as a practical solution and opens a new scientific area at the interface between thermal and computational sciences. The traditional linear and passive thermal components, such as thermal resistors and capacitors, are not sufficient to introduce an integrated thermal logic circuit. It is needed to realize switchable and nonlinear thermal components as their electronic counterparts, which leads to tunable thermal control devices and paves the way for thermal computation technology and thermal information treatment.Much research efforts have been done to realize thermal diodes, switches, transistors, and thermal logic gates 1-3 . The non-linear behavior of the temperature/phase-dependent thermal conductivity of certain materials was successfully employed to demonstrate thermal switch and regulators 4-9 . Additionally, thermal switches and regulators were realized by tailoring heat conduction through solid/solid and solid/liquid physical contact 10,11 , and by manipulating convection heat transfer mechanisms [12][13][14][15] . Another research efforts, which employed thermal radiation, were promising solutions 16-21 . However, the challenge is to develop individual thermal rectifiers or diodes and thermal logic circuits that are not limited to a small operating temperatures or specific materials. Previously, we built and simulated a thermal calculator based on clustered NanoThermoMechanical logic gates that could perform similar operations as their electronic counterparts. We presented the design and modeling of the NanoThermoMechanical AND, OR, and NOT logic gates, achieved through the coupling between near-field thermal radiation (NFTR) and MEMS thermal actuation 22 . NFTR transfers heat via thermal radiation between two surfaces separated by a very small vacuum gap (i.e., comparable to the radiation wavelength). NFTR's intensity increases exponentially with a d...

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Thermal Rectification Enhancement of Coalescence–Jumping Phase Transition Thermal Diodes using Cu–Al₂O₃ Hybrid Nanofluids

et al. 2021

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Herein, a novel coalescence–jumping phase transition thermal diode using hybrid nanofluids, an emerging thermal fluid with proven supreme thermal properties, is first proposed and investigated. The thermal rectification enhancement mechanism is investigated by the evaporation performances of a working fluid‐filled superhydrophilic porous tank. Furthermore, a developed mathematical model is well‐matched with the experimental results in terms of the heat transfer and thermal rectification performance of the thermal diodes using hybrid nanofluids. It is worth noting that increasing the volume fraction of the hybrid nanofluids does not necessarily improve the thermal rectification performance of the thermal diodes due to the aggregative nanoparticle deposition on the evaporation surface. In addition, there is a need to balance the thermal conductivity (higher copper proportion) and stability (higher alumina proportion) of the hybrid nanofluids used in the thermal diodes for long‐term operation. The experimental results show that the thermal rectification performance of the thermal diode using Cu‐Al2O3 hybrid nanofluid can be increased to 637.4, showing a nearly 300% improvement compared with the thermal diode using water. Overall, the remarkable results in this study promote the applications and studies of thermal diodes using hybrid nanofluids in various engineering systems for thermal management.

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Thermal calculator

Cited by 24 publications

References 9 publications

Fluidic and Mechanical Thermal Control Devices

Fluidic and Mechanical Thermal Control Devices

NanoThermoMechanical AND and OR Logic Gates

Thermal Rectification Enhancement of Coalescence–Jumping Phase Transition Thermal Diodes using Cu–Al₂O₃ Hybrid Nanofluids

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Thermal calculator

Cited by 24 publications

References 9 publications

Fluidic and Mechanical Thermal Control Devices

Fluidic and Mechanical Thermal Control Devices

NanoThermoMechanical AND and OR Logic Gates

Thermal Rectification Enhancement of Coalescence–Jumping Phase Transition Thermal Diodes using Cu–Al2O3 Hybrid Nanofluids

Contact Info

Product

Resources

About

Thermal Rectification Enhancement of Coalescence–Jumping Phase Transition Thermal Diodes using Cu–Al₂O₃ Hybrid Nanofluids