2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) 2017
DOI: 10.1109/eptc.2017.8277491
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Thermal characterization for dual side SiP module technology

Bo-Syun Chen
1
,
Tang-Yuan Chen
2
,
Jinfeng Yang
3
et al.
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Cited by 6 publications
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Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

Liu
1
,
Chien
2
,
Tseng
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Enhanced Reliability of a RF-SiP with Mold Encapsulation and EMI Shielding

Liu
1
,
Chien
2
,
Tseng
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
1
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Heterogeneous Integration of Double Side SiP for IoT and 5G Application

Chiu
1
,
Tsai
2
,
He
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Simulation of Heat Dissipation of CPU Chip in Smart Phone

Zeng,
Zhong,
Zeng
et al. 2024
2024 25th International Conference on Electronic Packaging Technology (ICEPT)
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