2015
DOI: 10.1108/ssmt-04-2015-0016
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Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive film

Abstract: 2015),"The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies", Soldering &If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research an… Show more

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