Thermal Expansion Challenges and Solution Strategies for Phase Change Material Encapsulation: A Comprehensive Review
Mingjian Xu,
Chenwu Shi,
Peihang Li
et al.
Abstract:Phase change materials (PCMs) have attracted increasing attention due to their efficient heat storage capability and small temperature fluctuation. And encapsulation has been recognized as an effective method to solve issues such as corrosion and leakage. For a long time, restricted by thermal expansion, encapsulation of PCMs has remained in the low‐temperature field and liquid‐state coating. In recent years, with the expansion of PCMs encapsulation into the medium and high temperature field and the developmen… Show more
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