2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2021
DOI: 10.1109/therminic52472.2021.9626519
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Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test

Tomoaki Hara1,
Yoshitaka Aoki2,
Tsuyoshi Funaki3
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