2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.243
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Thermal Isolation within High-Power 2.5D Heterogenously Integrated Electronic Packages

Michael Fish
1
,
Patrick McCluskey
2
,
Avram Bar‐Cohen
3
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Cited by 7 publications
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