Thermal model of multilayer structure for NDT thermal parameters evaluation

Abstract

This paper presents the study on the mechanism of heat transport in multilayer solid body with the assumption that the heat transfer proceeds with the aid of thermal conductivity. It presents a test conducted with lock-in thermography on multilayer structure with implanted defect. The structure is made from materials of different thermal conductivity k. Different layers of tested structure described by thermal resistance and thermal capacity create supplementary circuit. The model contains the elements of the reactance character and can be used not only in qualification of static schedule of temperature, but also in investigation of transient processes.