Thermal performance evaluation of Power QFN package with stacked and side by side die configuration

Ng, Cheong Chiang

doi:10.1109/impact.2015.7365173

Cited by 5 publications

(1 citation statement)

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“…Integrated circuit (IC) packaging has been ramping up to use in the automotive sector. An automotive device is an electronic device used in an automobile/car such as for engine management, driver safety, air bag system, tire pressure sensor, door lock system, in-car entertainment and others [1][2][3][4] as Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Effect of Epoxy Molding Compound Material and Roughness Leadframe to Integrated Circuit Package for Automotive Devices

2020

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This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.

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Section: Introductionmentioning

confidence: 99%