IEEE 2013 Tencon - Spring 2013
DOI: 10.1109/tenconspring.2013.6584504
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Thermal structure design for enhanced heat spreading in 3D ICs

Jin‐Woo Jeong
1
,
Seonghun Jang
2
,
Woongkyu Choi
3
et al.
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Cited by 4 publications
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References 6 publications
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An accurate calculation method on thermal effectiveness of TSV and wire

Pi
1
,
Wang
2
,
Jin
3
2016
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
4
0
3
0
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An accurate calculation method on thermal effectiveness of TSV and wire

Pi
1
,
Wang
2
,
Jin
3
2016
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
4
0
3
0
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Thermal characterization of a novel 3D stacked package structure by CFD simulation

Chen
1
,
Qiu
2
,
Hou
3
et al. 2016
2016 17th International Conference on Electronic Packaging Technology (ICEPT)
7
0
0
0
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Steady-State Thermal Simulation of the InP HBT Device Heat Spreading in DAHI Chip

Wang
1
,
Zhang
2
,
Li
3
et al. 2019
2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)
1
0
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