2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00134
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Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects

Shuhang Lyu,
Thomas E. Beechem,
Tiwei Wei
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