AIP Conference Proceedings
 2010
DOI: 10.1063/1.3527126
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Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Suk Kyu Ryu
1
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Kaijun Lu
2
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Xuefeng Zhang
3
et al.
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Cited by 12 publications
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Signal integrity and heat transfer performance of through-boron nitride via

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Signal integrity and heat transfer performance of through-boron nitride via

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et al. 2024
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TSV electrical and mechanical modeling for thermo-mechanical delamination

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SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform

Steller
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Meinecke
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Gottfried
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et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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