Three-axis thermal accelerometer based on buckled cantilever microstructure

Ma, A.H.; Leung, Albert M.

doi:10.1109/icsens.2008.4716728

Cited by 16 publications

(18 citation statements)

References 4 publications

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“…Microelectromechanical systems (MEMS) accelerometers have been widely used in various application fields, such as consumer electronics, automobiles, medical, structural health monitoring, and inertial navigation [1,2,3,4]. According to the displacement or force transduction mechanisms, MEMS accelerometers can be categorized as different types, including piezoelectric [5,6], capacitive [7,8], piezoresistive [9,10], tunneling [11,12], resonant [13,14,15,16], optical [17,18], thermal [19,20], and electromagnetic [21,22] accelerometers. Capacitive transduction is one of the most commonly used technologies for high-performance MEMS accelerometers since it takes advantage of simple structure, low noise, low power consumption, cost-effectiveness, and reliability [4].…”

Section: Introductionmentioning

confidence: 99%

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

et al. 2019

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This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable proof mass die and the glass cover plate through the flip-chip packaging. In order to implement a high-performance accelerometer, several technologies are applied: the through-silicon-wafer-etching process is used to increase the weight of proof mass for lower thermal noise, connection beams are used to reduce the cross-sensitivity, and the periodic array area-variation capacitive displacement transducer is applied to increase the displacement-to-capacitance gain. The accelerometer prototype is fabricated and characterized, demonstrating a scale factor of 510 mV/g, a noise floor of 2 µg/Hz1/2 at 100 Hz, and a bias instability of 4 µg at an averaging time of 1 s. Experimental results suggest that the proposed MEMS capacitive accelerometer is promising to be used for inertial navigation, structural health monitoring, and tilt measurement applications.

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Section: Introductionmentioning

confidence: 99%

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

et al. 2019

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“…A stack of two or more patterned layers forms an in-plane free-standing structure that can be assembled and locked to a desirable out-of-plane position and orientation. Because of this feature, out-of-plane structures can also be used to position transducers that can benefit from different orientations to detect or manipulate some direction-dependent physics [3,[6][7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Out‐of‐plane buckled cantilever microstructures with adjustable angular positions using thermal bimorph actuation for transducer applications

Arevalo

Castells-Rufas

Castro

et al. 2015

Micro & Nano Letters

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The integration of thermal bimorph actuators and buckled cantilever structures to form an out-of-plane plate with adjustable angular positions is reported. This structure could be used as a platform to build other transducers such as optical micromirrors, scanning antennas, switches or low-frequency oscillators. The electromechanical characterisation has shown that these structures can adjust their angular position by 6°when they are operated using a DC source. The thermal characterisation performed by an infrared camera showed that the heat-affected zone reaches a maximum temperature of 125°C while the rest of the structure remains unaffected by the generated heat.

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“…In recent, it is wildly applied in the mobile phone to detect the attitude for image display. Conventional inclinometers were manufactured on silicon wafers [1][2][3][4][5][6][7][8][9][10][11][12]; some of them applying thermal convection are simpler in structure [1][2][3][4][5][6][7]. Six new ideas are presented in this paper.…”

Section: Introductionmentioning

confidence: 99%

A Novel RFID-Based Thermal Convection Type Inclinometer with Nonfloating Structure and Xenon Gas

Lin¹,

Cheng²

2013

Proceedings of the 2013 International Conference on Advanced Computer Science and Electronics Information

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This research proposes a novel wireless RFID-based thermal convection inclinometer. Six new ideas are presented. The first one is to make it on a flexible substrate to reduce the energy dissipation through the traditional silicon. The second one is to integrate both an inclinometer and a wireless RFID antenna on the same substrate, such that it becomes a wireless sensor and very convenient for usage. The third idea is to apply a hemi-cylindrical chamber instead of the previous rectangular one, so the gas distribution is more streamlined to increase the sensitivity. The fourth idea is to apply xenon gas instead of the traditional carbon dioxide; the latter may oxidize the heater and the thermal sensors. The fifth idea is to use a nonfloating structure instead of the floating one, thus it is more simple and low cost without making a cavity in the substrate. The sixth idea is to apply a stacking material for the temperature sensors, so that the sensitivities are better. Three kinds of stacking height were studied, such as 1, 1.5 and 2mm. Moreover, three types of material with different thermal conductivity are also tested, such as alumina nitride (AlN), copper and silicon. One can see the combination of AlN/2mm is better, and the sensitivity curve is approximate to a theoretical sinusoidal one.

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Three-axis thermal accelerometer based on buckled cantilever microstructure

Cited by 16 publications

References 4 publications

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

Out‐of‐plane buckled cantilever microstructures with adjustable angular positions using thermal bimorph actuation for transducer applications

A Novel RFID-Based Thermal Convection Type Inclinometer with Nonfloating Structure and Xenon Gas

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