Three-dimensional finite element analysis of thin films cracking along ceramic substrates

Amiri, A.; Belhouari, M.; Bounoua, N.; Achour, T.; Bouiadjra, B. Bachir

doi:10.1016/j.mechrescom.2012.10.004

Cited by 5 publications

(9 citation statements)

References 25 publications

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“…The distribution of the J parameter along the crack front is symmetrical compared to its center. This behavior was confirmed numerically [39] for interfacial crack.…”

Section: Discussionsupporting

confidence: 68%

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Three-dimensional finite element analysis of a crack normal to and terminating at a bi-material interface

Mehidi

Kaddouri

Belhouari

et al. 2014

J Braz. Soc. Mech. Sci. Eng.

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eigenfunction expansion technique. Zak and Williams [1] showed that the stress field singularity at the tip of a crack perpendicular to an interface or terminating at the interface is of order r −λ , where λ is the real part of the eigenvalue and depends on the elastic properties of the bi-material. Bogy [2] investigated the stress singularity of an infinite crack terminating at the interface with an arbitrary angle of different material components. Cook and Erdogan [3] used the Mellin transform method to derive the governing equation of a finite crack perpendicular to the interface and obtained the stress intensity factors (SIFs). The authors found that the power singularity of stress around the crack tip is not −1/2. Erdogan and Biricikoglu [4] solved the problem of two bounded half planes with a crack going through the interface. Wang and Chen [5] used photoelasticity to determine the stress distribution and the stress intensity factors of a crack perpendicular to the interface [6-8], and also used finite element to analyze cracks perpendicular to bimaterial in a finite elastic body. Chen [9] used the body force method to determine the stress intensity factors for a normal crack terminating at a bi-material interface. Chen et al.[10] used the dislocation simulation approach to investigate the crack tip parameters for a crack perpendicular to an interface in a finite solid. He and Hutchinson [11] also considered cracks approaching the interface at oblique angles. Lin and Mar [6] presented a finite element analysis of the stress intensity factors for cracks perpendicular to the bi-material interface. Chang and Xu [12] presented the singular stress field and the stress intensity factors solution for an inclined crack terminating at a bi-material interface. A theoretical description of the stress singularity at an inclined crack terminating at an anisotropic bi-material interface was proposed by Lin and Sung [13]. Wang and Stahle [14,15] used the dislocation simulation approach to investigate a crack perpendicular to and terminating at the Abstract The objective of the present work is to investigate the interaction between interfaces and cracks normal to and terminating at a metal/alumina interface. The behavior is analyzed by the determination of the J integral and the plastic zone at the crack tip using the three-dimensional finite element methods. The effects of the thickness of the metal/alumina were highlighted. The obtained results allow us to deduce mathematical relations, giving the variation of the J integral and the plastic zone as a function of the crack position and the bi-materials thickness.

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“…The distribution of the J parameter along the crack front is symmetrical compared to its center. This behavior was confirmed numerically [39] for interfacial crack.…”

Section: Discussionsupporting

confidence: 68%

“…The distribution of the J integral along the crack front is symmetrical. This behavior was confirmed numerically by Amiri et al [39] for interfacial crack. The values of the J integral increase with the decrease of thickness ratio e/w.…”

Section: Methodssupporting

confidence: 72%

Three-dimensional finite element analysis of a crack normal to and terminating at a bi-material interface

Mehidi

Kaddouri

Belhouari

et al. 2014

J Braz. Soc. Mech. Sci. Eng.

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“…Поэтому в процессе нагружения подложка обычно испытывает только упругую деформацию, а пленка деформируется пластически. При этом на пленке возможно образование складок (гофрирование) и трещин, приводящих к уменьшению ее прозрач-ности и проводимости [2][3][4][5][6][7][8][9]. Механизмы деформации и разрушения тонкопленочных структур хорошо изучены, но ввиду того, что сложно учесть все процессы, происходящие в материале, изучение усталост-ного поведения тонких пленок проводится экспериментально.…”

Section: поступило в редакцию 11 января 2018 гunclassified

“…Моделирование напряжений, возникающих в пленке при изгибе, проведено при помощи программы ANSYS Workbench с использованием метода конечных элементов [2,3,6,7]. Суть метода заключается в разбиении объема исследуемого образца на гексагональные элементы малого размера.…”

Section: поступило в редакцию 11 января 2018 гunclassified

Нейросетевой Метод Прогнозирования Образования Дефектов На Поверхности Тонких Пленок ITO При Механических Нагрузках

Кириенко¹,

Березина²

2018

Письма В Журнал Технической Физики

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“…Recently, the effects of the thickness of the film on the crack density in the film and the crack initiation strain were investigated based on a residual stress model [ 12 ]. The effects of the specimen thickness and crack length on the variation of J integral were obtained by three dimensional finite element simulation [ 13 ]. The fracture mode was also found to change from coating cracking to interface cracking with increasing coating thickness [ 14 ].…”

Section: Introductionmentioning

confidence: 99%

Interface Strength, Damage and Fracture between Ceramic Films and Metallic Substrates

Liang

Chen

et al. 2021

Materials

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Interface strength, damage and fracture properties between ceramic films and metallic substrates affect the service reliability of related parts. The films’ thickness, grain size and residual stress affect the interface properties and fracture behavior, thus related studies attract great attention. In this paper, the interface damage evolution and fracture behavior between ceramic films and metallic substrates were simulated by developing a three dimensional finite element model of alumina films on Ni substrates with cohesive elements in the interfaces. The interface fracture energy as a key parameter in the simulation was firstly determined based on its thermodynamic definition. The simulation results show the Mises stress distribution and damage evolution of the film/substrate structures during uniaxial tensile loading. Specially, when grain size of the films is in nanoscale, the interface strength increases obviously, agreeing with the previous experimental results. The effects of residual stress on interface properties was further simulated. The interface strength was found to decrease with increasing radial residual force and the axial residual pressure increases the interface strength. When the thickness of the films increases, the interface strength keeps a constant but the speed of interface damage becomes faster, that is, the thicker films show catastrophic fracture. The underlying mechanism of damage speed was analyzed. Understanding these size effects and the effects of residual stress is helpful to guide the design of related parts.

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Three-dimensional finite element analysis of thin films cracking along ceramic substrates

Cited by 5 publications

References 25 publications

Three-dimensional finite element analysis of a crack normal to and terminating at a bi-material interface

Three-dimensional finite element analysis of a crack normal to and terminating at a bi-material interface

Нейросетевой Метод Прогнозирования Образования Дефектов На Поверхности Тонких Пленок ITO При Механических Нагрузках

Interface Strength, Damage and Fracture between Ceramic Films and Metallic Substrates

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